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BY228GP-E3/73
Features Of BY228GP-E3/73
  • Superectifier structure for high reliability application

  • Cavity-free glass-passivated junction

  • Low forward voltage drop

  • Typical I R less than 0.1 μA

  • High forward surge capability

  • Solder dip 275 °C max. 10 s, per JESD 22-B106

  • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

Details Of BY228GP-E3/73


Zkhk BY228GP-E3/73

Specifications Of BY228GP-E3/73

Details Of BY228GP-E3/73

Zkhk Details Of BY228GP-E3/73


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