Glass passivated junction chip
Ideal for automated placement
Fast switching for high efficiency
High surge current capability
Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC
Halogen-free according to IEC 61249-2-21
Case: DO-214AC (SMA)
Molding compound: UL flammability classification rating 94V-0
Part No. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.064g(approximately)
(TA=25℃ unless otherwise noted)
PARAMETER | SYMBOL | BYG20D | BYG20G | BYG20J | UNIT |
Maximum repetitive peak reverse voltage | VRRM | 200 | 400 | 600 | V |
Maximum RMS voltage | VRMS | 140 | 280 | 420 | V |
Maximum DC blocking voltage | VDC | 200 | 400 | 600 | V |
Maximum average forward rectified current | IF(AV | 1.5 | A | ||
Peak forward surge current,8.3 ms single half sine-wave superimposed on rated load | lFSM | 30 | A | ||
Maximum instantaneous forward voltage lF=1.0A (Note 1) lF=1.5A | VF | 1.3 1.4 | V | ||
Maximum reverse current @rated VR TJ=25℃ TJ=100℃ | lR | 1 10 | μA | ||
Pulse energy in avalanche mode, non-repetitive (Inductive load switch off), L=120mH | ERSM | 20 | mJ | ||
Maximum reverse recovery time (Note 2) | trr | 75 | ns | ||
Typical thermal resistance(Note 3) | RθJL | 25 | ℃/W | ||
RθJA | 100 | ||||
Operating junction temperature range | TJ | -55 to +150 | ℃ | ||
Storage temperature range | TSTG | -55 to +150 | ℃ |
Note 1: Pulse test with PW=300μs,1% duty cycle
Note 2: Reverse recovery test conditions: lF=0.5A, lR=1.0A, lRR=0.25A
Note 3: Mount on PC board with 5mm x 5mm copper pads as heatsink.